Process Optimization of Single-Step Photolithography
نویسندگان
چکیده
Abstract Due to the precision and sizing requirements of popular semiconductor devices nowadays, thickness control uniformity optimization photoresist during photolithography process are thought be critical issues for engineers consider. In this paper, parameters affecting thoroughly analyzed an economic novel approach improving spin coating is presented. Integrated Nanosystems Research Facility at California Institute Telecommunications Information Technology (Calit2), 8 silicon wafers were coated with a positive named Shipley 1827 purpose. At end author concludes several essential but easily ignored factors that can affect photoresist. By following given rules, high quality single-layer wafer ease.
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ژورنال
عنوان ژورنال: Journal of physics
سال: 2022
ISSN: ['0022-3700', '1747-3721', '0368-3508', '1747-3713']
DOI: https://doi.org/10.1088/1742-6596/2386/1/012065